Mechanisms For Forming Bonding Structures
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang, Chung-Shi Liu
Life of this patent
Estimating the term…
Abstract
Embodiments of mechanisms for forming a package are provided. The package includes a substrate and a contact pad formed on the substrate. The package also includes a conductive pillar bonded to the contact pad through solder formed between the conductive pillar and the contact pad. The solder is in direct contact with the conductive pillar.
Claims20
A method for forming a package structure, the method comprising:
- providing a first substrate having a plurality of contact pads formed thereon;
- applying a first solder on the plurality of contact pads;
- attaching a plurality of conductive pillars on the plurality of contact pads by the first solder, the first solder extending between the plurality of contact pads and the plurality of conductive pillars;
- and
- after attaching the plurality of conductive pillars, bonding a second substrate to the plurality of conductive pillars with a second solder.
A method for forming a package structure, the method comprising:
- applying a first conductive material to a first contact pad of a first substrate;
- after applying the first conductive material to the first contact pad, attaching a conductive pillar to the first conductive material, the conductive pillar being completely separated from the first contact pad by the first conductive material;
- and
- attaching a second substrate to the conductive pillar, the second substrate having a second contact pad and a second conductive material, the second conductive material completely separating the conductive pillar from the second contact pad.
A method for forming a package structure, comprising:
- applying a first conductive material to a first contact pad of a first substrate;
- after applying the first conductive material to the first contact pad, reflowing the first conductive material and attaching a first end of a conductive pillar to the first conductive material;
- and
- after reflowing the first conductive material, reflowing a second conductive material attaching a second end of the conductive pillar to a second contact pad of a second substrate, thereby bonding the first substrate to the second substrate, the conductive pillar being spaced apart from the first contact pad and the second contact pad.
Dependencies are inferred from the claim text.