Enhanced cleaning for water-soluble flux soldering
AssigneeInternational Business Machines Corporation
InventorsCharles C. Bureau, Eric Duchesne, Kang-Wook Lee, Isabelle Paquin, Dragoljub Veljanovic
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Abstract
An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.
Claims19
A method for an electronic assembly process comprising:
- receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux;
- baking the at least one electronic assembly in an oxygen containing environment, and
- cleaning the at least one electronic assembly in an aqueous cleaning process.
The method of claim 17, wherein hydrolysis of Sn(IV) carboxylate flux residue during the aqueous cleaning process does not yield insoluble crystals.
Dependencies are inferred from the claim text.