Back to results
US 2018/0005974 A1Published application
Semiconductor device including interconnected package on package
AssigneeSanDisk Information Technology (Shanghai) Co., Ltd.
InventorsChin-Tien Chiu, Hem Takiar
Life of this patent
Estimating the term…
Abstract
A semiconductor device is disclosed including at least first and second vertically stacked and interconnected semiconductor packages. Signal communication between the second semiconductor package and a host device occurs through the first semiconductor package.
Claims26
A semiconductor device, comprising:
- a first semiconductor package, comprising:
- a first substrate,
- a first plurality of semiconductor die,
- an interposer layer having a plurality of solder balls affixed to a surface of the interposer layer, and
- a first mold compound encapsulating at least a portion of the first semiconductor package, at least a portion of the solder balls extending through a surface of the first mold compound;
- and
- a second semiconductor package, comprising:
- a second substrate comprising contact pads on a surface of the second substrate,
- a second plurality of semiconductor die, and
- a second mold compound encapsulating at least a portion of the second semiconductor package;
- a pattern of the solder balls extending through the surface of the first mold compound matching a pattern of the contact pads on the surface of the second substrate, the solder balls being affixed to the contact pads to couple the first semiconductor package to the second semiconductor package.
8 more elements
A semiconductor device, comprising:
- a first semiconductor package, comprising:
- a first substrate,
- a first plurality of semiconductor die,
- an interposer layer having a plurality of contact pads in a surface of the interposer layer, and
- a first mold compound encapsulating at least a portion of the first semiconductor package, the contact pads being exposed through a surface of the first mold compound;
- and
- a second semiconductor package, comprising:
- a second substrate comprising:
- contact pads on a surface of the second substrate, and
- solder balls affixed to the contact pads,
- a second plurality of semiconductor die, and
- a second mold compound encapsulating at least a portion of the second semiconductor package;
- a pattern of the solder balls on the contact pads of the second substrate matching a pattern of the contact pads on the surface of the interposer layer, the solder balls being affixed to the contact pads to couple the first semiconductor package to the second semiconductor package.
10 more elements
A semiconductor device, comprising:
- a first semiconductor package, comprising:
- a first substrate comprising a first set of contact pads on a surface of the first substrate,
- a first plurality of semiconductor die,
- an interposer layer having a plurality of contacts,
- a first set of wire bonds extending between the interposer layer, the first plurality of semiconductor die and the first substrate,
- a second set of wire bonds extending between the interposer layer and the first substrate, bypassing the first plurality of semiconductor die, and
- a first mold compound encapsulating at least a portion of the first semiconductor package;
- a second semiconductor package, comprising:
- a second substrate comprising a second set of contact pads on a surface of the second substrate,
- a second plurality of semiconductor die,
- a third set of wire bonds extending between the second plurality of semiconductor die and the second substrate, and
- a second mold compound encapsulating at least a portion of the second semiconductor package;
- solder connecting the plurality of contacts on the interposer layer with the second set of contact pads on the surface of the second substrate to electrically couple the first and second semiconductor packages.
10 more elements
A semiconductor device, comprising:
- a first semiconductor package, comprising:
- a first substrate comprising a first set of contact pads on a surface of the first substrate,
- a first plurality of semiconductor die,
- an interposer means for transferring voltages between the first semiconductor package and a second semiconductor package,
- a first electrical connection means for transferring voltages between the interposer means, the first plurality of semiconductor die and the first substrate,
- a second electrical connection means for transferring voltages between the interposer layer and the first substrate, bypassing the first plurality of semiconductor die, and
- a first mold compound encapsulating at least a portion of the first semiconductor package;
- the second semiconductor package, comprising:
- a second substrate comprising a second set of contact pads on a surface of the second substrate,
- a second plurality of semiconductor die,
- a third electrical connection means for transferring voltages between the second plurality of semiconductor die and the second substrate, and
- a second mold compound encapsulating at least a portion of the second semiconductor package;
- and
- connecting means for connecting the plurality of contacts on the interposer layer with the second set of contact pads on the surface of the second substrate to electrically couple the first and second semiconductor packages.
11 more elements
Dependencies are inferred from the claim text.