Side Ported MEMS Sensor Device Package and Method of Manufacturing Thereof
AssigneesAkustica, Inc., Robert Bosch GmbH
InventorMikko VA Suvanto
Life of this patent
Estimating the term…
Abstract
A MEMS sensor device package comprises a sensor assembly comprising a sensor device and a sensor circuit communicating coupled to the sensor device, The MEMS sensor device package further comprises an assembly package housing having a top member and a bottom member attached to the top member for encapsulating the sensor assembly. A passageway fluidly coupled the sensor device to attributes outside the package housing the passageway is embedded into the package housing, wherein the top member comprising a top wall and side walls, the side walls are attached to the bottom member, and the passageway is embedded into at least one of the side walls.
Claims20
A MEMS sensor device assembly comprising:
- a sensor assembly comprising a sensor device and a sensor circuit communicating coupled to the sensor device;
- a package housing comprising a top member and a bottom member attached to the top member for encapsulating the sensor assembly;
- a passageway fluidly coupled the sensor device to attributes outside the package housing the passageway is embedded into the package housing;
- wherein the top member comprising a top wall and side walls, the side walls are attached to the bottom member, and the passageway is embedded into at least one of the side walls.
A combo MEMS sensor device package comprising:
- a package housing comprising a top member and a bottom member attached to the top member and a divider wall for separating the package housing into two cavities;
- a first sensor assembly and a second sensor assembly, each first and second sensor assembly is disposed in separate cavities;
- a passageway fluidly coupled to the first sensor assembly;
- wherein the first sensor assembly disposed in one of the cavities is non-hermetically sealed.
Dependencies are inferred from the claim text.