Electronic component device, method of mounting electronic component device on circuit board, and mounting structure of electronic component device on circuit board
AssigneeMurata Manufacturing Co., Ltd.
InventorKazushi WATANABE
Life of this patent
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Abstract
An electronic component device includes a mount substrate including an outer electrode on one principal surface and a mount electrode on another principal surface, at least one substrate component including a terminal electrode on one principal surface, and that is mounted on the mount substrate by joining the terminal electrode to the mount electrode, and a sealing resin layer that is provided on the mount substrate on which the at least one substrate component is mounted. The sealing resin layer includes a region with a large thickness, and a top surface including an inclination.
Claims20
An electronic component device comprising:
- a mount substrate including an outer electrode on one principal surface and a mount electrode on another principal surface;
- at least one substrate component including a terminal electrode on one principal surface, and that is mounted on the mount substrate by the terminal electrode being joined to the mount electrode;
- and
- a sealing resin layer that is provided on the mount substrate on which the at least one substrate component is mounted;
- wherein
- the sealing resin layer includes an increased thickness region, and a top surface including an inclination.
A method of mounting an electronic component device on a circuit board, the method comprising the steps of:
- preparing a circuit board including a mount electrode on one principal surface;
- preparing the electronic component device including a mount substrate including an outer electrode on one principal surface, at least one substrate component that is mounted on another principal surface of the mount substrate, and a sealing resin layer that is formed on the mount substrate on which the at least one substrate component is mounted, the sealing resin layer including an increased thickness region;
- providing a soft joining material on the mount electrode that is formed on the circuit board;
- temporarily disposing the electronic component device on the circuit board such that a gap between the electronic component device and the circuit board becomes smallest at the increased thickness region of the sealing resin layer by bringing the outer electrode into contact with the joining material and disposing the electronic component device on the circuit board and subsequently pushing the electronic component device in a direction of the circuit board to push the outer electrode into the joining material;
- and
- joining the mount electrode and the outer electrode to each other with the joining material by heating and melting the joining material and cooling and solidifying the joining material.
A mounting structure of an electronic component device on a circuit board, wherein
- the circuit board includes a mount electrode on one principal surface;
- the electronic component device includes a mount substrate including an outer electrode on one principal surface, at least one substrate component that is mounted on another principal surface of the mount substrate, and a sealing resin layer that is provided on the mount substrate on which the at least one substrate component is mounted, the sealing resin layer including an increased thickness region;
- the mount electrode and the outer electrode are joined to each other with a joining material;
- and
- the electronic component device has a largest height at the increased thickness region of the sealing resin layer.
Dependencies are inferred from the claim text.