Package carrier and manufacturing method of package carrier
AssigneeUnimicron Technology Corp.
InventorsYung-Ching Lin, Chen-Chun Liu
Life of this patent
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Abstract
A package carrier including a flexible substrate, a first build-up structure and a second build-up structure is provided. The flexible substrate has a first surface and a second surface opposite to each other, and has a first opening connected between the first surface and the second surface. The first build-up structure is disposed on the first surface and covers the first opening. The second build-up structure is disposed on the second surface and has a second opening, and the first opening and the second opening are connected to each other to form a chip accommodating cavity together. In addition, a manufacturing method of the package carrier and a chip package structure having the package carrier are also provided.
Claims12
A package carrier, comprising:
- a flexible substrate, having a first surface and a second surface opposite to each other, and having a first opening connected between the first surface and the second surface;
- a first build-up structure, disposed on the first surface and covering the first opening;
- and
- a second build-up structure, disposed on the second surface and having a second opening, wherein the first opening and the second opening are connected to each other to form a chip accommodating cavity together.
A manufacturing method of a package carrier, comprising:
- providing a flexible substrate, wherein the flexible substrate has a first surface and a second surface opposite to each other;
- forming a first build-up structure on the first surface;
- forming a second build-up structure on the second surface;
- cutting the flexible substrate and the second build-up structure, so as to make a first to-be-removed region of the flexible substrate separated from other regions of the flexible substrate, and make a second to-be-removed region of the second build-up structure separated from other regions of the second build-up structure, wherein the first to-be-removed region is connected to the second to-be-removed region;
- and
- separating the first to-be-removed region from the first build-up structure, so as to remove the first to-be-removed region and the second to-be-removed region simultaneously to form a chip accommodating cavity.
Dependencies are inferred from the claim text.