Device, system and method to interconnect circuit components on a transparent substrate

A system for interconnecting circuitry, the system comprising:

• a transparent substrate;
• a first multilayer circuit bonded at a surface of the transparent substrate;
• a first circuit component coupled, via first traces at a first surface portion of the transparent substrate, to first input/output (IO) contacts of the first multilayer circuit;
• a second circuit component coupled, via second traces at a second surface portion of the transparent substrate, to second IO contacts of the first multilayer circuit;
• and
• one or more display elements disposed on the transparent substrate, the one or more display elements coupled to the first circuit component and the second circuit component to generate a display based on a signal communicated via the first multilayer circuit.

A method for interconnecting circuitry, the method comprising:

• bonding a first multilayer circuit at a transparent substrate;
• coupling a first circuit component, via first traces at a first surface portion of the transparent substrate, to first input/output (IO) contacts of the first multilayer circuit;
• and
• coupling a second circuit component, via second traces at a second surface portion of the transparent substrate, to second IO contacts of the first multilayer circuit.