Cavity Generation For Embedded Interconnect Bridges Utilizing Temporary Structures
AssigneeIntel Corporation
InventorsSrinivas V. PIETAMBARAM, Rahul N. MANEPALLI
Life of this patent
Estimating the term…
Abstract
Embodiments are generally directed to cavity generation for an embedded interconnect bridge utilizing a temporary structure. An embodiment of a package includes a substrate; a silicon interconnect bridge including a plurality of interconnections, the interconnect bridge being embedded in the substrate; and a plurality of contacts on a surface of the substrate, the plurality of contacts being coupled with the plurality of interconnections of the interconnect bridge. The interconnect bridge is bonded in a cavity in the substrate, the cavity being formed by removal of at least one temporary structure from the substrate.
Claims25
A package comprising:
- a substrate;
- a silicon interconnect bridge including a plurality of interconnections, the interconnect bridge being embedded in the substrate;
- and
- a plurality of contacts on a surface of the substrate, the plurality of contacts being coupled with the plurality of interconnections of the interconnect bridge;
- wherein the interconnect bridge is bonded in a cavity in the substrate, the cavity being formed by removal of at least one temporary structure from the substrate.
A method comprising:
- fabricating a package substrate;
- placing at least one temporary structure in a first location on the substrate;
- subsequent to placing the at least one temporary structure in the first location on the substrate, applying a first dielectric material to the substrate to surround at least a portion of the at least one temporary structure;
- subsequent to applying the first dielectric material to the substrate, removing the at least one temporary structure from the package substrate to generate a cavity in the substrate;
- bonding an interconnect bridge in the cavity, the interconnect bridge including a plurality of interconnections;
- applying a second dielectric material to the substrate;
- and
- installing a plurality of contacts to a surface of the substrate, the plurality of contacts being coupled with the interconnect bridge.
A semiconductor package produced by a process comprising the following:
- fabricating a package substrate;
- placing at least one temporary structure in a first location on the substrate;
- subsequent to placing the at least one temporary structure in the first location on the substrate, applying a first dielectric material to the substrate to surround at least a portion of the at least one temporary structure;
- subsequent to applying the first dielectric material to the substrate, removing the at least one temporary structure from the package substrate to generate a cavity in the substrate;
- bonding an interconnect bridge in the cavity, the interconnect bridge including a plurality of interconnections;
- applying a second dielectric material to the substrate;
- and
- installing a plurality of contacts to a surface of the substrate, the plurality of contacts being coupled with the interconnect bridge.
A system comprising:
- a multi-die package including:
- a substrate;
- a silicon interconnect bridge including a plurality of interconnections, the interconnect bridge being embedded in the substrate;
- and
- a plurality of contacts on a surface of the substrate including a first set of contacts and a second set of contacts, the plurality of contacts being coupled with the plurality of interconnections of the interconnect bridge;
- a plurality of components including at least a first die and a second die, the first die coupled with the first set of contacts and a second die coupled with the second set of contacts, the embedded interconnect bridge to provide interconnects between the first die and the second die;
- and
- a touch screen display to display data processed at least in part by the plurality of components;
- wherein the interconnect bridge is bonded in a cavity in the substrate, the cavity being formed by removal of at least one temporary structure from the substrate.
Dependencies are inferred from the claim text.