Substrate with sub-interconnect layer
AssigneeIntel Corporation
InventorsEng Huet Goh, Jiun Hann Sir, Min Suet Lim, Khang Choong Yong
Life of this patent
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Abstract
Electrical interconnect technology for a package substrate is disclosed. A substrate can include a first conductive element at least partially disposed in a first routing layer, and a second conductive element at least partially disposed in a second routing layer. The first and second routing layers are adjacent routing layers. The substrate can also include a third conductive element having first and second portions disposed in the first routing layer, and an intermediate third portion disposed in a “sub-interconnect layer” between the first and second routing layers.
Claims29
A substrate, comprising:
- a first conductive element at least partially disposed in a first routing layer;
- a second conductive element at least partially disposed in a second routing layer, wherein the first and second routing layers are adjacent routing layers;
- and
- a third conductive element having first and second portions disposed in the first routing layer, and an intermediate third portion disposed between the first and second routing layers.
An electronic device package, comprising:
- a substrate having
- a first conductive element at least partially disposed in a first routing layer,
- a second conductive element at least partially disposed in a second routing layer,
- wherein the first and second routing layers are adjacent routing layers, and
- a third conductive element having first and second portions disposed in the first routing layer, and an intermediate third portion disposed between the first and second routing layers;
- and
- an electronic component operably coupled to at least one of the first, second, and third conductive elements.
A method for making a substrate, comprising:
- forming a recess in a first dielectric material portion;
- disposing conductive material in the recess to form a first portion of a first conductive element;
- disposing a second dielectric material portion at least partially on the first portion of the first conductive element;
- forming second and third portions of the first conductive element at least partially on one or more of the first dielectric material portion and the second dielectric material portion, wherein the first, second, and third portions of the first conductive element are electrically coupled to one another;
- and
- forming a second conductive element at least partially on the second dielectric material portion.
Dependencies are inferred from the claim text.