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AssigneeSchweizer Electronic AG
InventorsThomas GOTTWALD, Christian ROESSLE
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The invention relates to an electronic component, namely a printed circuit board element comprising a first semiconductor component (14) which is arranged on an upper side of an electrically conductive intermediate plate (16) such that a connector pad (18) of the semiconductor component (14) is electrically contacted with the intermediate plate (16) and comprising a second semiconductor component (15) which is arranged on a lower side of the intermediate plate (16). The second semiconductor component (15) comprises a first connector pad (17) and a second connector pad (19), wherein both connector pads (17, 19) are aligned in the direction of the intermediate plate (16) and wherein the first connector pad (17) is contacted with the intermediate plate (16), and wherein the second connector pad (19) is not contacted with the intermediate plate (16). Moreover, the invention relates to a method for producing such a printed circuit board element.
A printed circuit board element comprising:
A method for producing a printed circuit board element, in which a first semiconductor component is arranged on an upper side of an electrically conductive intermediate plate such that a connector pad of the semiconductor component has a whole-area electrical contact with the intermediate plate and in which a second semiconductor component is arranged on a lower side of the intermediate plate, wherein the second semiconductor component comprises a first connector pad and a second connector pad, wherein the two connector pads are aligned in the direction of the intermediate plate and wherein the first connector pad is contacted with the intermediate plate, wherein the second connector pad is not contacted with the intermediate plate, and wherein the intermediate plate is designed as a phase tap of the printed circuit board element.
The method as claimed in claim 16, wherein a first hole is produced in the intermediate plate before the attachment of the semiconductor component, the position of said hole corresponding to the second connector pad of the lower semiconductor component.
The method as claimed in claim 17, wherein the hole is filled with an insulating material, a second hole with a smaller diameter subsequently being drilled into said insulating material.
The method as claimed in claim 18, wherein the wall of the second hole is coated with a layer made of a conductive material such that a ring-shaped structure arises.
The method as claimed in claim 19, wherein a layer is applied, by means of which an end face of the ring-shaped structure is closed.
The method as claimed in claim 20, wherein the ring-shaped structure is electrically insulated from the surroundings.
The method as claimed in claim 22, wherein the region with a thinner material strength is embodied as a blind hole.
Dependencies are inferred from the claim text.