Via and trench filling using injection molded soldering
AssigneeInternational Business Machines Corporation
InventorsJohn U. Knickerbocker, Shriya Kumar, Jae-Woong Nah
Life of this patent
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Abstract
A method includes forming one or more vias in a substrate, forming a first photoresist layer on a top surface of the substrate and a second photoresist layer on a bottom surface of the substrate, patterning the first photoresist layer and the second photoresist layer to remove at least a first portion of the first photoresist layer and at least a second portion of the second photoresist layer, filling the one or more vias, the first portion and the second portion with solder material using injection molded soldering, and removing remaining portions of the first photoresist layer and the second photoresist layer.
Claims20
An apparatus comprising:
- a substrate having one or more vias formed therein;
- and
- one or more interconnects disposed through respective ones of the one or more vias;
- wherein at least one of the interconnects extends from a top surface of the substrate through at least one of the vias to a bottom surface of the substrate, said at least one interconnect comprising:
- a first portion disposed on the top surface of the substrate surrounding said at least one via;
- a second portion disposed on the bottom surface of the substrate surrounding said at least one via;
- and
- a third portion connecting the first portion and the second portion;
- wherein the first portion, the second portion and the third portion of the at least one interconnect comprises injection molded solder material.
An integrated circuit comprising:
- a glass interposer having one or more vias formed therein;
- and
- one or more interconnects disposed through respective ones of the one or more vias;
- wherein at least one of the interconnects extends from a top surface of the substrate through at least one of the vias to a bottom surface of the substrate, said at least one interconnect comprising:
- a first portion disposed on the top surface of the substrate surrounding said at least one via;
- a second portion disposed on the bottom surface of the substrate surrounding said at least one via;
- and
- a third portion connecting the first portion and the second portion;
- wherein the first portion, the second portion and the third portion of the at least one interconnect comprises injection molded solder material.
Dependencies are inferred from the claim text.