Fan-out package structure and method

A method comprising:

• attaching a semiconductor structure on a carrier, wherein the semiconductor structure comprises a connector, and wherein a top surface of the connector is substantially level with a top surface of the semiconductor structure;
• depositing a molding compound layer over the carrier, wherein the semiconductor structure is embedded in the molding compound layer;
• exposing a first photo-sensitive material layer and a second photo-sensitive material layer to light;
• developing the first photo-sensitive material layer and the second photo-sensitive material layer to form an opening having a first portion in the first photo-sensitive material layer and a second portion in the second photo-sensitive material layer, wherein a width of the second portion is greater than a width of the first portion;
• filling the opening with a conductive material to form a via in the first photo-sensitive material layer and a redistribution layer in the second photo-sensitive material layer;
• and
• forming a bump over the redistribution layer.

A method comprising:

• attaching a semiconductor structure on a carrier;
• depositing a molding compound layer over the carrier, wherein the semiconductor structure is embedded in the molding compound layer;
• applying a grinding process to the molding compound layer until a top surface of the semiconductor structure is exposed;
• depositing a first photo-sensitive material layer over the molding compound layer and exposing the first photo-sensitive material layer to light;
• depositing a second photo-sensitive material layer over the first photo-sensitive material layer and exposing the second photo-sensitive material layer to light;
• developing the first photo-sensitive material layer and the second photo-sensitive material layer to form an opening having a first portion in the first photo-sensitive material layer and a second portion in the second photo-sensitive material layer;
• and
• filling the opening with a conductive material to form a via in the first portion and a redistribution layer in the second portion.