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US 2018/0005926 A1Published application
Semiconductor device and method of manufacturing the same
AssigneeMitsubishi Electric Corporation
InventorsYuji IWAI, Katsumi MIYAWAKI
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Abstract
A semiconductor device includes a lead frame comprising a first terminal and a second terminal for grounding, a sealing resin which covers the lead frame, an exposed part which is a part of the second terminal and is exposed from the sealing resin and a conductive material which covers the surface of the sealing resin and contacts the second terminal at the exposed part.
Claims17
A semiconductor device comprising:
- a lead frame comprising a first terminal and a second terminal for grounding;
- a sealing resin which covers the lead frame;
- an exposed part which is a part of the second terminal and is exposed from the sealing resin;
- and
- a conductive material which covers the surface of the sealing resin and contacts the second terminal at the exposed part.
2 more elements
A method of manufacturing a semiconductor device comprising:
- a step for sealing for covering a lead frame comprising a first terminal and a second terminal for grounding by a sealing resin so as to form a exposed part which is exposed from the sealing resin in the second terminal;
- and
- a step for forming a conductive material for applying the conductive material on the surface of the sealing resin so that the conductive material contacts the second terminal at the exposed part.
Dependencies are inferred from the claim text.