Packaged semiconductor device having a lead frame and inner and outer leads and method for forming

A packaged integrated circuit (IC) device comprising:

• a lead frame with a die pad;
• leads around a periphery of the die pad, wherein:
• the leads have an inner portion and an outer portion,
• the inner portion of each of the leads is between a periphery of the die pad and extends to one end of a section having reduced width,
• the outer portion of each of the leads extends from an opposite end of the section having reduced width,
• each lead in a first subset of the leads is between two leads in a second subset of the leads,
• the inner portion of the first subset of the leads is bent at the one end of the section having reduced width to prevent contact with the inner portion of the second subset of the leads,
• the outer portion of one of the first or second subsets of the leads is bent at the opposite end of the section having reduced width to prevent contact with the outer portion of the other one of the first or second subsets of leads, and
• the outer portion of the other one of the first or second subsets of the leads is bent at a distance from the opposite end of the section having reduced width.

A method of making a packaged integrated circuit (IC) device comprising:

• stamping a matrix of lead frames from a sheet of material, wherein each of the lead frames includes a die pad;
• forming leads around each of the die pads, wherein:
• the leads have a section of reduced width between an inner portion and an outer portion of the leads,
• each lead in a first subset of the leads is between two leads in a second subset of the leads,
• bending the inner portion of the first subset of the leads at the one end of the section having reduced width to prevent contact with the inner portion of the second subset of the leads,
• bending the outer portion of one of the first or second subsets of the leads at the opposite end of the section having reduced width to prevent contact with the outer portion of the other one of the first or second subsets of leads,
• wherein the outer portion of the other one of the first or second subsets of the leads is bent at a distance from the opposite end of the section having reduced width.