Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsYasutaka SHIMIZU, Yoshitaka OTSUBO, Mituharu TABATA
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Abstract
A semiconductor device includes: a circuit pattern, at least one or more wires joined thereto, an electrode terminal joining thereto, and a semiconductor element. The electrode terminal includes a horizontally extending portion extending along a main surface and connected to the wire, and a bent portion at which an extending direction of the electrode terminal is changed relative to the horizontally extending portion. Each of the wires has joint portions at which each of the wires and the circuit pattern are joined to each other. In a plan view, the joint portions are located on an outside of a portion where each of the wires and the electrode terminal overlap each other.
Claims9
A semiconductor device comprising:
- a circuit pattern formed on one main surface of an insulating substrate and at least partially having conductivity;
- at least one or more wires joined to the circuit pattern and having conductivity,
- an electrode terminal joined to the wires, thereby being electrically connected to the circuit pattern;
- and
- a semiconductor element joined to the circuit pattern,
- the electrode terminal including a horizontally extending portion extending along the one main surface and connected to the wires, and a bent portion at which an extending direction of the electrode terminal is changed relative to the horizontally extending portion,
- each of the wires having a joint portion at which each of the wires and the circuit pattern are joined to each other,
- in a plan view, the joint portion being located on an outside of a portion where each of the wires and the electrode terminal overlap each other.
Dependencies are inferred from the claim text.