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US 2018/0005921 A1Published application
Information processing device and cooling unit
AssigneeFujitsu Limited
InventorsKeizou Takemura, JIE WEI, Mitsutaka YAMADA, Michimasa AOKI, Masumi SUZUKI
Life of this patent
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Abstract
An information processing device includes a substrate configured to include a mounting surface above which an electronic component is mounted; a flow passage configured to include a flow path through which a cooling medium flows and be arranged above the mounting surface; and a cooler configured to be detachably coupled with the flow passage and cool the electronic component.
Claims20
An information processing device comprising:
- a substrate configured to include a mounting surface above which an electronic component is mounted;
- a flow passage configured to include a flow path through which a cooling medium flows and be arranged above the mounting surface;
- and
- a cooler configured to be detachably coupled with the flow passage and cool the electronic component.
1 more element
A cooling unit comprising:
- a flow passage configured to include a flow path through which a cooling medium flows and be arranged above a mounting surface of a substrate above which an electronic component is mounted;
- and
- a cooler configured to be detachably coupled with the flow passage and cool the electronic component.
Dependencies are inferred from the claim text.