Semiconductor structure and associated method for manufacturing the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsCHIN-LIANG CHEN, CHI-YANG YU, KUAN-LIN HO, YU-MIN LIANG
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Abstract
A method for manufacturing a semiconductor structure is disclosed. The method includes: providing a semiconductor substrate having a plurality of dies thereon; dispensing an underfill material and a molding compound to fill spaces beneath and between the dies; disposing a temporary carrier over the dies; thinning a thickness of the semiconductor substrate; performing back side metallization upon the thinned semiconductor substrate; removing the temporary carrier; and attaching a plate over the dies. An associated semiconductor structure is also disclosed.
Claims24
A method for manufacturing a semiconductor structure, comprising:
- providing a semiconductor substrate having a plurality of dies thereon;
- dispensing a first underfill material and a molding compound to fill spaces beneath and between the dies;
- disposing a temporary carrier over the dies;
- thinning a thickness of the semiconductor substrate;
- performing back side metallization upon the thinned semiconductor substrate;
- removing the temporary carrier;
- attaching a plate over the dies;
- sawing the semiconductor substrate and the plate to obtain a singulated semiconductor structure;
- mounting the singulated semiconductor structure on a carrier;
- and
- dispensing a second underfill material between the singulated semiconductor structure and the carrier.
(canceled)
A method for manufacturing a semiconductor structure, comprising:
- providing a semiconductor substrate having a plurality of dies thereon;
- dispensing an underfill material and a molding compound to fill spaces beneath and between the dies;
- attaching a plate over the dies after dispensing the underfill material and the molding compound;
- thinning a thickness of the semiconductor substrate after attaching the plate;
- performing back side metallization upon the thinned semiconductor substrate after thinning the semiconductor substrate;
- and
- sawing the semiconductor substrate including the plate.
(canceled)
(canceled)
(canceled)
(canceled)
A method for manufacturing a semiconductor structure, comprising:
- providing a semiconductor substrate having an interconnection structure at a front side thereof;
- providing a die having a conductive bump;
- disposing the die over the semiconductor substrate to couple the conductive bump to the interconnection structure;
- disposing a first carrier over the die;
- performing metallization upon a back side of the semiconductor substrate;
- removing the first carrier;
- and
- attaching a plate over the dies;
- sawing the semiconductor substrate and the plate to obtain a singulated semiconductor structure;
- mounting the singulated semiconductor structure on a second carrier;
- and
- dispensing an underfill material between the singulated semiconductor structure and the second carrier.
(canceled)
Dependencies are inferred from the claim text.