Semiconductor structure and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsCHIN-LIANG CHEN, CHI-YANG YU, KUAN-LIN HO, YU-MIN LIANG
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Abstract
The present disclosure provides a semiconductor device. The semiconductor packaged device includes a first semiconductor die having a first surface. The semiconductor packaged device also includes a dielectric material surrounding the first semiconductor die, where the dielectric material comprises a surface substantially leveled with the first surface. The semiconductor packaged device further includes a capping layer covering the first surface of the first semiconductor die and the surface of the dielectric material. An adhesivity between the capping layer and a dicing tape is lower than an adhesivity between the dielectric material and the dicing tape.
Claims21
A semiconductor packaged device, comprising:
- a first semiconductor die comprising a first surface;
- a dielectric material surrounding the first semiconductor die, the dielectric material comprising a surface substantially leveled with the first surface;
- and
- a metal layer contacting the first surface of the first semiconductor die and covering an entirety of the surface of the dielectric material, wherein an adhesivity between the metal layer and a dicing tape is lower than an adhesivity between the dielectric material and the dicing tape.
A semiconductor packaged device, comprising:
- a semiconductor die;
- a first dielectric material surrounding the semiconductor die laterally and including a sidewall facing away from the semiconductor die;
- and
- a metal layer contacting a top surface of the semiconductor die and covering an entirety of an upper surface of the first dielectric material, wherein a sidewall of the capping metal layer is aligned with the sidewall of the first dielectric material, wherein an adhesivity between the metal layer and a dicing tape is lower than an adhesivity between the dielectric material and the dicing tape.
17-20. (canceled)
A semiconductor packaged device, comprising:
- a first semiconductor die;
- a second semiconductor die spaced apart from the first semiconductor die;
- a first dielectric material surrounding the first semiconductor die and the second semiconductor die;
- and
- a metal layer contacting the first semiconductor die and the second semiconductor die and covering an entirety of an upper surface of the first dielectric material, and the metal layer is configured to be in contact with a dicing tape, wherein an adhesivity between the metal layer and the dicing tape is lower than an adhesivity between the first dielectric material and the dicing tape.
Dependencies are inferred from the claim text.