Placement base for semiconductor device and vehicle equipment
AssigneeShindengen Electric Manufacturing Co., Ltd.
InventorsToyohide TAKAHASHI, Takuji YAMASHIRO
Life of this patent
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Abstract
A placement base (100) of a semiconductor device (90) comprises a body (10), to which a radiation agent (80) having viscosity is applied and on which a semiconductor device (90) is disposed, and a protrusion (20), which is placed in an outer periphery of the body (10) and on which the semiconductor device (90) is not disposed. A detective groove (30) for introducing the radiation agent (80) is provided on a surface of the protrusion (20).
Claims8
A placement base of a semiconductor device comprising:
- a body, to which a radiation agent having viscosity is applied and on which the semiconductor device is disposed;
- and
- a protrusion, which is placed in an outer periphery of the body and on which the semiconductor device is not disposed,
- wherein a detective groove for introducing the radiation agent is provided on a surface of the protrusion
- wherein a surface of the body is provided with a body-side groove in such a manner that a central part of the body is intermittently or continuously surrounded by the body-side groove, and
- wherein the body-side groove and the detective groove is communicated with each other.
A placement base of a semiconductor device comprising:
- a body, to which a radiation agent having viscosity is applied and on which the semiconductor device is disposed;
- and
- a protrusion, which is placed in an outer periphery of the body and on which the semiconductor device is not disposed,
- wherein a detective groove for introducing the radiation agent is provided on a surface of the protrusion,
- wherein the body has a substantially quadrilateral shape, when seen from above,
- wherein three protrusions are provided to three sides of the body, and
- wherein each protrusion is provided with the detective groove.
A placement base of a semiconductor device comprising:
- a body, to which a radiation agent having viscosity is plied and on which the semiconductor device is disposed;
- a protrusion, which is placed. in an outer periphery of the body and on which the semiconductor device is not disposed;
- and
- a fixing unit for fixing the semiconductor device, and
- wherein a detective groove for introducing the radiation agent is provided on a surface of the protrusion,
- wherein the body has a supporting unit being configured to support at least a part of a periphery of the semiconductor device, and a bottom surface placed in an inner periphery of the supporting unit and placed lower than the supporting unit,
- wherein the fixing unit is provided to the supporting unit, and
- wherein a body-side groove communicated with the detective grooves is provided between the fixing unit and the bottom surface.
(canceled)
Dependencies are inferred from the claim text.