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US 2018/0005908 A1Published application
Semiconductor device
AssigneeRohm Co., Ltd.
InventorToshio NAKASAKI
Life of this patent
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Abstract
A semiconductor device includes: a semiconductor element; a first bonding pad formed on a surface of the semiconductor element; a test pad formed on the surface of the semiconductor element separately from the first bonding pad and configured to be visually distinguishable from the first bonding pad; and a first bonding member connected to the first bonding pad and used for external electrical connection.
Claims17
A semiconductor device, comprising:
- a semiconductor element;
- a first bonding pad formed on a surface of the semiconductor element;
- a test pad formed on the surface of the semiconductor element separately from the first bonding pad and configured to be visually distinguishable from the first bonding pad;
- and
- a first bonding member connected to the first bonding pad and used for external electrical connection.
2 more elements
Dependencies are inferred from the claim text.