Wafer transfer device
AssigneeLG Siltron Inc.
InventorSo Mi KIM
Life of this patent
Estimating the term…
Abstract
An embodiment comprises: a guide moving in the vertical direction or the horizontal direction; a transfer arm provided on the guide and loading spaced apart wafers; a laser emission unit disposed on the guide and emitting first laser beams at the spaced apart wafers loaded on the transfer arm; and a laser detection unit disposed below the transfer arm and collecting, from among the first laser beams, second laser beams having passed through gaps between the spaced apart wafers.
Claims14
A wafer transfer device comprising:
- a guide configured to move in a vertical direction or in a horizontal direction;
- a moving arm provided on the guide and configured to seat wafers, which are spaced apart from each other, thereon;
- a laser emission unit disposed on the guide and configured to emit a first laser to the wafers, which are seated on the moving arm and are spaced apart from each other;
- and
- a laser detection unit disposed under the moving arm and configured to collect a second laser that is a portion of the first laser and has passed through a gap between the wafers, which are spaced apart from each other.
7-13. (canceled)
A wafer-processing method of processing wafers mounted on a wafer transfer device including a laser emission unit configured to emit a laser and a laser detection unit configured to detect the laser, the method comprising:
- emitting a laser to the wafers mounted on the wafer transfer device by the laser emission unit;
- detecting a laser that has passed between the wafers mounted on the wafer transfer device by the laser detection unit;
- measuring a thickness of the wafers mounted on the wafer transfer device based on the detected result;
- and
- processing the wafers mounted on the wafer transfer device based on the measured thickness.
Dependencies are inferred from the claim text.