US 2018/0005889 A1Published application

Method for collective (wafer-scale) fabrication of electronic devices and electronic device

AssigneesSTMicroelectronics (Grenoble 2) SAS, STMicroelectronics S.r.l., Commissariat A L'energie Atomique Et Aux Energies Alternatives

InventorsDidier Campos, Benoit Besancon, Perceval Coudrain, Jean-Philippe Colonna

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Abstract

Electronic devices are manufactured using a collective (wafer-scale) fabrication process. Electronic chips are mounted onto one face of a collective substrate wafer. A collective flexible sheet made of a heat-conductive material comprising a layer containing pyrolytic graphite is fixed to extend over a collective region extending over the electronic chips and over the collective substrate wafer between the electronic chips. The collective flexible sheet is then compressed. A dicing operation is then carried out in order to obtain electronic devices each including an electronic chip, a portion of the collective plate and a portion of the collective flexible sheet.

Claims19

Dependent claims

A method for wafer-scale fabrication of electronic devices, comprising the following steps:

a) mounting a plurality of electronic chips onto a mounting face of a collective substrate wafer, said electronic chips being separated from one another and positioned on location sites,
b) extending a collective flexible sheet comprising at least one layer made of a heat-conductive material that contains pyrolytic graphite over a collective region running over the electronic chips and over the mounting face of the collective substrate wafer and between the electronic chips,
c) compressing the collective flexible sheet in the direction of the collective region, and
d) carrying out a dicing in order to obtain electronic devices respectively comprising at least one of the electronic chips, a portion of the collective substrate wafer corresponding to a location site and a portion of the collective flexible sheet corresponding to this location site.

1 more element

Dependencies are inferred from the claim text.