Semiconductor device and semiconductor chip
AssigneeLapis Semiconductor Co., Ltd.
InventorFUJIYUKI MINESAKI
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AssigneeLapis Semiconductor Co., Ltd.
InventorFUJIYUKI MINESAKI
Estimating the term…
The present disclosure provides a semiconductor device including: a semiconductor chip including a circuit having a predetermined function, at least one first terminal connected to the circuit, and plural second terminals not connected to the circuit, the first and second terminals being formed along one edge of the semiconductor chip; plural third terminals provided at positions outside of the semiconductor chip and opposing the one edge, each of the plural third terminals being connected to one of the plural second terminals by a respective first wire; and an electronic component provided between the semiconductor chip and the third terminals, the electronic component including a fourth terminal that is connected to the first terminal by a second wire and is disposed below some of the first wires, wherein the first terminal is disposed at a position such that the first and second wires do not intersect.
A semiconductor device comprising:
A semiconductor chip having a rectangular external profile comprising:
Dependencies are inferred from the claim text.