Back to results
US 2018/0005879 A1Published application
Via and trench filling using injection molded soldering
AssigneeInternational Business Machines Corporation
InventorsJohn U. Knickerbocker, Shriya Kumar, Jae-Woong Nah
Life of this patent
Estimating the term…
Abstract
A method includes forming one or more vias in a substrate, forming at least one liner on at least one sidewall of at least one of the vias, and filling said at least one via with solder material using injection molded soldering. The at least one liner may comprise a solder adhesion layer, a barrier layer, or a combination of a barrier layer and a solder adhesion layer.
Claims21
A method comprising:
- forming one or more vias in a substrate;
- forming at least one liner on at least one sidewall of at least one of the vias, said at least one liner comprising a solder adhesion layer;
- forming a metal layer on the solder adhesion layer;
- filling said at least one via with solder material using injection molded soldering;
- and
- thermally annealing the filled via to form an intermetallic compound from the solder material and at least a portion of the metal layer
- wherein the liner and the metal layer are formed with a total thickness in the range of about one-half to three-quarters of a diameter of said at least one via;
- and
- wherein the at least one via is formed with a height to width ratio of about five to one or greater.
6 more elements
9-13. (canceled)
16-20. (canceled)
Dependencies are inferred from the claim text.