Semiconductor manufacturing apparatus and method of operating the same
AssigneeToshiba Memory Corporation
InventorYuya MATSUDA
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Abstract
In one embodiment, a semiconductor manufacturing apparatus includes an electrostatic chuck that includes a base and a first electrode provided on the base and is configured to electrostatically adsorb a wafer on the first electrode. The apparatus further includes a measurement module configured to measure potential of the wafer. The apparatus further includes a controller configured to adjust potential of the base based on the potential of the wafer and to adjust potential of the first electrode based on the potential of the wafer or the base, when the potential of the wafer measured by the measurement module changes.
Claims18
A semiconductor manufacturing apparatus comprising:
- an electrostatic chuck that includes a base and a first electrode provided on the base and is configured to electrostatically adsorb a wafer on the first electrode;
- a measurement module configured to measure potential of the wafer;
- and
- a controller configured to adjust potential of the base based on the potential of the wafer and to adjust potential of the first electrode based on the potential of the wafer or the base, when the potential of the wafer measured by the measurement module changes.
A method of operating a semiconductor manufacturing apparatus, comprising:
- mounting a wafer on a base of an electrostatic chuck through a first electrode;
- electrostatically adsorbing the wafer with the electrostatic chuck;
- measuring potential of the wafer with a measurement module;
- and
- adjusting potential of the base based on the potential of the wafer and adjusting potential of the first electrode based on the potential of the wafer or the base, when the potential of the wafer measured by the measurement module changes.
Dependencies are inferred from the claim text.