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US 2018/0005853 A1Published application
Multiple wafer single bath etcher
AssigneeTruTag Technologies, Inc.
InventorsTam Kim, Craig Leidholm
Life of this patent
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Abstract
An etcher comprises a bath, a plurality of blades, and a tunnel. The bath includes a first electrode at a first end and a second electrode at a second end. The plurality of blades is configured to fit in the bath. At least one blade of the plurality of blades holds a wafer. At least one tunnel is configured to fit between adjacent blades of the plurality of blades in the bath.
Claims17
An etcher, comprising:
- a bath with a first electrode at a first end and a second electrode at a second end;
- a plurality of blades configured to fit in the bath, wherein at least one blade of the plurality of blades holds a wafer, wherein the first blade holds the wafer using a vacuum clamp at a backside outer edge of the wafer;
- and
- at least one tunnel, wherein the at least one tunnel is configured to fit between adjacent blades of the plurality of blades in the bath.
1 more element
A method for etching, comprising:
- providing a bath with a first electrode at a first end and a second electrode at a second end;
- providing a plurality of blades configured to fit the bath, wherein a first blade of the plurality of blades holds a wafer, wherein the first blade holds the wafer using a vacuum clamp at a backside outer edge of the wafer;
- providing a tunnel, wherein the tunnel is configured to fit between the first blade of the plurality of blades and a second blade of the plurality of blades in the bath;
- and
- etching the wafer.
2 more elements
Dependencies are inferred from the claim text.