Substrate, semiconductor package including the same, and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsLi Chuan TSAI, Chih-Cheng LEE, Cheng-Lin HO
Life of this patent
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Abstract
A substrate includes a dielectric layer having a first surface and a second surface opposite to the first surface, a first circuit layer and at least one second conductive element. The first circuit layer is disposed adjacent to the first surface of the dielectric layer, and includes at least one trace and at least one first conductive element connected to the trace. The first conductive element does not extend through the dielectric layer. The second conductive element extends through the dielectric layer. An area of an upper surface of the second conductive element is substantially equal to an area of an upper surface of the first conductive element.
Claims32
A substrate, comprising:
- a dielectric layer having a first surface and a second surface opposite to the first surface;
- a first circuit layer disposed adjacent to the first surface of the dielectric layer, and including at least one trace and at least one first conductive element connected to the trace, wherein the first conductive element does not extend through the dielectric layer;
- and
- at least one second conductive element extending through the dielectric layer, wherein an area of an upper surface of the second conductive element is substantially equal to an area of an upper surface of the first conductive element.
A semiconductor package, comprising:
- a substrate, including:
- a dielectric layer having a first surface and a second surface opposite to the first surface;
- a first circuit layer disposed adjacent to the first surface of the dielectric layer, and including at least one trace and at least one first conductive element connected to the trace, wherein the first conductive element does not extend through the dielectric layer;
- and
- at least one second conductive element extending through the dielectric layer, wherein an area of an upper surface of the second conductive element is substantially equal to an area of an upper surface of the first conductive element;
- and
- a die, including a plurality of connecting elements, wherein at least one of the connecting elements is electrically connected to the first conductive element, and at least another one of the connecting elements is electrically connected to the second conductive element;
- and
- an encapsulant covering the die and the substrate.
A method for manufacturing a substrate, comprising:
- providing a first circuit layer including a trace and a first conductive element connected to the trace;
- providing a dielectric layer having a first surface and a second surface opposite to the first surface and covering the first circuit layer, wherein the first circuit layer is disposed adjacent to the first surface of the dielectric layer;
- providing a mask layer on the second surface of the dielectric layer, wherein the mask layer defines a plurality of openings;
- forming a plurality of through holes in the dielectric layer corresponding to the openings of the mask layer;
- and
- filling the through holes of the dielectric layer with a conductive material and disposing a second circuit layer on the second surface of the dielectric layer.
A method for manufacturing a substrate, comprising:
- providing a first circuit layer including a trace and a first conductive element connected to the trace;
- providing a dielectric layer having a first surface and a second surface opposite to the first surface and covering the first circuit layer, wherein the first circuit layer is disposed adjacent to the first surface of the dielectric layer, and the dielectric layer is made of a photo-imageable material;
- forming a plurality of through holes of the dielectric layer by lithography, wherein each of the plurality of through holes includes an upper portion adjacent to the first surface of the dielectric layer, and an area of a cross section of the upper portion is substantially equal to an area of an upper surface of the first conductive element;
- and
- filling the through holes with a conductive material and disposing a second circuit layer on the second surface of the dielectric layer.
Dependencies are inferred from the claim text.