Packing method for semiconductor device

A packing method for a semiconductor device comprising the steps of:

• (a) preparing a semiconductor device including a sealing body that has a first principal surface, a rear surface opposite to the first principal surface, and a side surface between the first principal surface and the rear surface, a plurality of leads that project from the side surface of the sealing body and are bent toward the rear surface, a semiconductor chip located within the sealing body, and a die pad that having one surface on which the semiconductor chip is mounted and another surface that is opposite to the one surface and has a portion exposed from the rear surface of the sealing body;
• (b) preparing a base carrier tape including a first peripheral portion and a second peripheral portion that extend in a first direction and are each provided with a plurality of holes, a step portion that is located between the first peripheral portion and the second peripheral portion in a second direction perpendicular to the first direction and extends in the first direction, and a plurality of pocket portions in the step portion arranged in the first direction;
• (c) placing the semiconductor device in the pocket portion of the base carrier tape;
• (d) bonding a cover tape to the step portion of the base carrier tape to cover the semiconductor device in such a manner that the sealing body is pressed against the base carrier tape;
• and
• (e) winding the base carrier tape with the semiconductor device placed therein and with the cover tape bonded thereto, around a tape reel,
• wherein the pocket portion includes a sealing-body placing portion and a lead placing portion,
• wherein the sealing-body placing portion includes a supporting portion to be in contact with the rear surface of the sealing body and a dent portion spaced away from the rear surface of the sealing body,
• wherein the base carrier tape includes a first surface in which the semiconductor device is placed and a second surface opposite to the first surface,
• wherein the first surface includes second surfaces of the first peripheral portion and the second peripheral portion, a third principal surface of the step portion, a fourth principal surface of the supporting portion, and a fifth principal surface of the dent portion,
• wherein the fifth principal surface of the dent portion is surrounded by the fourth principal surface of the supporting portion in a plan view,
• wherein in the step (d), in a cross-sectional view along the second direction,
• the third principal surface of the step portion is located between the second principal surfaces and the fourth principal surface,
• a height from the fourth principal surface to the third principal surface is lower than a height from the fourth principal surface to the second principal surfaces,
• a height from the fifth principal surface to the fourth principal surface is lower than a height from the fifth principal surface to the third principal surfaces, and
• a height from the fourth principal surface to the first principal surface of the sealing body is higher than a height from the fourth principal surface to the third principal surface of the step portion.