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US 2018/0005816 A1Published application
Semiconductor laminate
AssigneeSumitomo Electric Industries, Ltd.
InventorsKenji Kanbara, Keiji Wada, Tsubasa Honke
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Abstract
A semiconductor laminate includes a silicon carbide substrate having a first main surface and a second main surface opposite the first main surface, and an epitaxial layer composed of silicon carbide disposed on the first main surface. The second main surface has an average value of roughness Ra of 0.1 μm or more and 1 μm or less with a standard deviation of 25% or less of the average value.
Claims13
A semiconductor laminate comprising:
- a silicon carbide substrate having a first main surface and a second main surface opposite the first main surface;
- and
- an epitaxial layer composed of silicon carbide disposed on the first main surface,
- wherein the second main surface has an average value of roughness Ra of 0.1 μm or more and 1 μm or less with a standard deviation of 25% or less of the average value.
1 more element
A semiconductor laminate comprising:
- a silicon carbide substrate having a first main surface and a second main surface opposite the first main surface;
- and
- an epitaxial layer composed of silicon carbide disposed on the first main surface,
- wherein the second main surface has an average value of roughness Ra of 0.1 μm or more and 1 μm or less with a standard deviation of 25% or less of the average value,
- wherein the semiconductor laminate has a bow of more than 0 μm and 10 μm or less when the first main surface is placed upward and has a diameter of 150 mm or more,
- wherein the silicon carbide substrate and the silicon carbide epitaxial layer each contain an impurity that generates majority carriers, and
- a concentration of the impurity in the silicon carbide substrate is higher than a concentration of the impurity in the epitaxial layer.
4 more elements
Dependencies are inferred from the claim text.