Magnetic Material Sputtering Target and Manufacturing Method Thereof
AssigneeJX Nippon Mining & Metals Corporation
InventorsShin-ichi Ogino, Yuichiro Nakamura
Life of this patent
Estimating the term…
Loading patent…
AssigneeJX Nippon Mining & Metals Corporation
InventorsShin-ichi Ogino, Yuichiro Nakamura
Estimating the term…
Provided is an oxide-containing magnetic material sputtering target wherein the oxides have an average grain diameter of 400 nm or less. Also provided is a method of producing an oxide-containing magnetic material sputtering target. The method involves depositing a magnetic material on a substrate by the PVD or CVD method, then removing the substrate from the deposited magnetic material, pulverizing the material to obtain a raw material for the target, and further sintering the raw material. An object is to provide a magnetic material target, in particular, a nonmagnetic grain-dispersed ferromagnetic sputtering target capable of suppressing discharge abnormalities of oxides that are the cause of particle generation during sputtering.
A method of producing a magnetic material sintered sputtering target containing nonmagnetic oxides, comprising the steps of:
A method of producing a magnetic material sintered sputtering target containing nonmagnetic oxides, comprising the steps of:
A method of producing a magnetic material sintered sputtering target containing nonmagnetic oxides, comprising the steps of:
Dependencies are inferred from the claim text.