Film forming apparatus
AssigneeToppan Printing Co., Ltd.
InventorMasato KON
Life of this patent
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Abstract
A film forming apparatus for forming a thin film on a flexible substrate. The film forming apparatus forms a thin film on a flexible substrate under vacuum. The film forming apparatus includes a first zone into which a first gas is introduced and a second zone into which a second gas is introduced in a vacuum chamber. Zone separators have openings through which the flexible substrate passes. The film forming apparatus includes a mechanism that reciprocates the flexible substrate between the zones. Further, the film forming apparatus includes a mechanism that supplies a raw material gas containing metal or silicon to the first zone, and a mechanism that performs sputtering of a material containing metal or silicon as a target material in the second zone.
Claims8
A film forming apparatus that forms a thin film on a flexible substrate transported in a vacuum chamber, the film forming apparatus comprising:
- a partition wall that separates the vacuum chamber into at least a first zone and a second zone, the partition wall including an opening through which the flexible substrate passes;
- a mechanism that reciprocates the flexible substrate between the first zone and the second zone;
- a mechanism that supplies raw material gas containing metal or silicon into the first zone;
- and
- a mechanism that is disposed in the second zone and performs sputtering of a material containing metal or silicon as a target material.
Dependencies are inferred from the claim text.