Mounting structure for mounting shunt resistor and method of manufacturing mounting structure for mounting shunt resistor

A mounting structure for mounting a shunt resistor comprising:

• a printed circuit board where a first conductive pattern and a second conductive pattern are formed on at least one surface of a substrate in a spaced-apart manner from each other;
• and
• a shunt resistor mounted on one surface of the printed circuit board with a bonding material made of a conductive material interposed therebetween, wherein
• the shunt resistor includes:
• a bridging portion spaced apart from the substrate;
• a first connecting portion continuously formed with one end of the bridging portion and electrically connected with the first conductive pattern with the bonding material interposed therebetween, and a second connecting portion continuously formed with the other end of the bridging portion and electrically connected with the second conductive pattern with the bonding material interposed therebetween,
• assuming an axis parallel to a predetermined direction extending from said one end to said the other end of the bridging portion as an x axis, a plane parallel to said one surface of the substrate as an xy plane, and an axis perpendicular to the x axis as a y axis, an axis parallel to a direction extending to said one surface of the substrate from the other surface of the substrate as a z axis, as viewed in a plan view of the xy plane, the first conductive pattern includes:
• a first lead-out portion led out in a +x direction;
• and a first pull-out portion pulled out to the outside of a region of the bridging portion from a distal end portion of the first lead-out portion, and the second conductive pattern includes:
• a second lead-out portion led out in a −x direction and spaced apart from the first lead-out portion;
• and a second pull-out portion pulled out to the outside of the region of the bridging portion from a distal end portion of the second lead-out portion, and
• a resistance value of the shunt resistor is detected between the first pull-out portion and the second pull-out portion, wherein
• as viewed in a cross section taken along an xz plane, at least one of the first lead-out portion and the second lead-out portion has a portion where a thickness in a z axis direction changes from a first thickness to a second thickness smaller than the first thickness, and a fillet of the bonding material terminates at a position corresponding to a position of the portion where the first lead-out portion or/and the second lead-out portion has/have the second thickness.

A mounting structure for mounting a shunt resistor comprising:

• a printed circuit board where a first conductive pattern and a second conductive pattern are formed on at least one surface of a substrate in a spaced-apart manner from each other;
• and
• a shunt resistor mounted on one surface of the printed circuit board with a bonding material made of a conductive material interposed therebetween, wherein
• the shunt resistor includes:
• a bridging portion spaced apart from the substrate;
• a first connecting portion continuously formed with one end of the bridging portion and electrically connected with the first conductive pattern with the bonding material interposed therebetween, and a second connecting portion continuously formed with the other end of the bridging portion and electrically connected with the second conductive pattern with the bonding material interposed therebetween,
• assuming an axis parallel to a predetermined direction extending from said one end to said the other end of the bridging portion as an x axis, a plane parallel to said one surface of the substrate as an xy plane, and an axis perpendicular to the x axis as a y axis, an axis parallel to a direction extending to said one surface of the substrate from the other surface of the substrate as a z axis, as viewed in a plan view of the xy plane, the first conductive pattern includes:
• a first lead-out portion led out in a +x direction;
• and a first pull-out portion pulled out to the outside of a region of the bridging portion from a distal end portion of the first lead-out portion, and the second conductive pattern includes:
• a second lead-out portion led out in a −x direction and spaced apart from the first lead-out portion;
• and a second pull-out portion pulled out to the outside of the region of the bridging portion from a distal end portion of the second lead-out portion, and
• a resistance value of the shunt resistor is detected between the first pull-out portion and the second pull-out portion, wherein
• as viewed in a plan view of the xy plane, at least one of the first lead-out portion and the second lead-out portion has a portion where a width in a y axis direction changes from a first width to a second width narrower than the first width, and a fillet of the bonding material terminates at a position corresponding to a position of a portion where the first lead-out portion or/and the second lead-out portion has/have the second width as viewed in a cross section taken along an xz plane.