Memory device, memory package including the same, and memory module including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSUNGCHUL PARK, CHANKYUNG KIM, Soo-Ho CHA
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AssigneeSamsung Electronics Co., Ltd.
InventorsSUNGCHUL PARK, CHANKYUNG KIM, Soo-Ho CHA
Estimating the term…
Disclosed are a memory device, a memory package including the same, and a memory module including the same. The memory package includes a first memory device configured to operate in response to a first chip select signal from an external device, a second memory device configured to operate in response to a second chip select signal from the external device, and a third memory device configured to operate in response to a third chip select signal from the external device. The third memory device includes a buffer unit that is connected with an internal circuit of the third memory device through an internal data line, is connected with the first memory device through a first memory data line, is connected with the second memory device through a second memory data line, and is connected with the external device through a data line.
A memory package comprising:
A memory module comprising:
A memory device comprising:
21-26. (canceled)
Dependencies are inferred from the claim text.