Hybrid lpddr4-dram with cached nvm and flash-nand in multi-chip packages for mobile devices
AssigneeFuturewei Technologies, Inc.
InventorsXiaobing Lee, Feng Yang, Yu Meng, Yunxiang Wu
Life of this patent
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AssigneeFuturewei Technologies, Inc.
InventorsXiaobing Lee, Feng Yang, Yu Meng, Yunxiang Wu
Estimating the term…
An apparatus comprises a hybrid-memory multi-chip package (MCP) including a non-volatile memory (NVM) in an NVM die; a dynamic random access memory (DRAM) in two or more DRAM die, wherein a portion of the DRAM is allocated as a cache memory for the NVM; and a hybrid controller for the NVM and DRAM. The hybrid controller includes an NVM interface to the NVM; a DRAM interface to the cache memory; a host interface to communicate data with a host processor, wherein the host interface includes a parallel data bus for reading and writing data directly with both of the DRAM and the NVM; and logic circuitry configured to interleave access by the host processor and hybrid controller to the DRAM and NVM.
(canceled)
The apparatus of claim 4, wherein the host interface includes a NVM chip select line and a command address control bus, wherein the hybrid controller is configured to perform an NVM control command or perform a read or write access to the NVM according to a DRAM activate (ACT) operation received via the command address control bus when the NVM chip select line is activated.
An apparatus comprising:
An apparatus comprising:
An apparatus comprising:
-22. (canceled)
Dependencies are inferred from the claim text.