Inspection method, inspection system, and method of manufacturing semiconductor package using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYounghoon SOHN, Yusin YANG
Life of this patent
Estimating the term…
Abstract
An inspection method includes generating first layout data including information on a shape of a first pattern group, generating second layout data including information on a shape of a second pattern group, obtaining a target image including images of the first and second pattern groups, and detecting a defect pattern from the target image by comparing the first and second layout data with the target image. The first pattern group, the second pattern group, and the defect pattern are provided at different heights from each other, from a top surface of a substrate.
Claims23
An inspection method comprising:
- generating first layout data, the first layout data including information on a first shape of a first pattern group;
- generating second layout data, the second layout data including information on a second shape of a second pattern group;
- obtaining a target image, the target image including images of the first pattern group and the second pattern group;
- and
- detecting a defect pattern based on the first layout data, the second layout data, and the target image, wherein
- the first pattern group, the second pattern group, and the defect pattern are patterns at different heights relative to a top surface of a substrate.
(canceled)
-24. (canceled)
A method of manufacturing a semiconductor package, the method comprising:
- forming a first pattern group on a substrate;
- measuring a first image of the first pattern group;
- generating first layout data based on the first image, the first layout data including information on a shape of the first pattern group;
- forming an interlayer layer covering the first pattern group on the substrate;
- forming a second pattern group on the interlayer layer;
- measuring a second image of the second pattern group;
- generating second layout data based on the second image, the second layout data including information on a shape of the second pattern group;
- measuring a target image including the first image and second image;
- and
- detecting a defect pattern from the target image based on the first layout data, the second layout data, and the target image, the defect pattern being at a height from the substrate between the first pattern group and the second pattern group.
(canceled)
A method of forming semiconductor packages, the method comprising:
- generating first layout data based on a measurement of a first interconnect in a first one of the semiconductor packages and a first defect associated therewith;
- generating second layout data based on a measurement of a second interconnect in the first one of the semiconductor packages and a second defect associated therewith, the second interconnect being connected to the first interconnect by a via in an interlayer layer therebetween such that the second layout data does not include the first interconnect and the first defect associated therewith;
- and
- detecting a third defect associated with the via based on the first layout data and the second layout data.
Dependencies are inferred from the claim text.