Flexible card with fingerprint sensor
AssigneeNEXT Biometrics Group ASA
InventorsKolja VOGEL, Jamie Lyn SHAFFER
Life of this patent
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Abstract
A prelam layer for use in forming a laminated card includes a flexible circuit substrate; a fingerprint sensor disposed on the flexible circuit substrate, the fingerprint sensor having upper and bottom surfaces, the bottom surface of the fingerprint sensor being disposed on the substrate, an active layer of the fingerprint sensor disposed towards the upper surface of the fingerprint sensor; a first integrated circuit chip disposed on the substrate and having at least one lead electrically connected to the flexible circuit substrate; and an adapter flexible circuit electrically bonded to the active layer of the fingerprint sensor. The integrated circuit chip is adapted to communicate with the fingerprint sensor through the adapter flexible circuit.
Claims20
A prelam layer for use in forming a laminated card, comprising:
- a flexible circuit substrate;
- a fingerprint sensor disposed on the flexible circuit substrate, the fingerprint sensor having upper and bottom surfaces, the bottom surface of the fingerprint sensor being disposed on said substrate, an active layer of the fingerprint sensor disposed towards the upper surface of the fingerprint sensor;
- a first integrated circuit chip disposed on said substrate and having at least one lead electrically connected to the flexible circuit substrate;
- and
- an adapter flexible circuit electrically bonded to the active layer of the fingerprint sensor, wherein the integrated circuit chip is adapted to communicate with the fingerprint sensor through the adapter flexible circuit.
A biometric system on card, comprising:
- at least one bottom lamination layer;
- a prelam layer disposed over the at least one bottom lamination layer, the prelam layer comprising:
- a flexible circuit substrate;
- a fingerprint sensor disposed on the flexible circuit substrate, the fingerprint sensor having upper and bottom surfaces, the bottom surface of the fingerprint sensor disposed on said substrate, an active layer of the fingerprint sensor disposed towards the upper surface of the fingerprint sensor;
- a first integrated circuit chip disposed on said substrate and having at least one lead electrically connected to the flexible circuit substrate;
- and
- an adapter flexible circuit electrically bonded to the active layer of the fingerprint sensor, wherein the first integrated circuit chip is adapted to communicate with the fingerprint sensor through the adapter flexible circuit;
- and
- at least one top lamination layer, the top lamination layer having a window formed therein overlying the fingerprint sensor.
Dependencies are inferred from the claim text.