Ultrasonic fingerprint recognition module and manufacturing method thereof

Abstract

An ultrasonic fingerprint recognition module and a manufacturing method thereof are provided. The ultrasonic fingerprint recognition module includes a substrate, an ultrasonic transmitter, a thin film transistor and an ultrasonic receiver. The method includes the following steps. In a step (a), the substrate, the ultrasonic transmitter, the thin film transistor and the ultrasonic receiver are provided. In a step (b), the ultrasonic transmitter is attached on a top surface of the substrate, and the ultrasonic transmitter is electrically connected with the substrate. In a step (c), the ultrasonic receiver is attached on the thin film transistor. In a step (d), the thin film transistor is attached on the ultrasonic transmitter. In a step (e), the ultrasonic receiver is electrically connected with the thin film transistor and the thin film transistor is electrically connected with the substrate through wires.

Dependencies are inferred from the claim text.