Method, apparatus and system for wide metal line for sadp routing

A method, comprising:

• receiving a design for an integrated circuit device, wherein said design comprises at least a first functional cell and a second functional cell;
• performing a placement process for placing said first and second functional cells based upon the design;
• and
• providing at a wide M2 metal formation for providing an interconnection between said first and second functional cells, wherein providing said interconnection comprising connecting a first M3 metal formation connected to said M2 metal formation and a portion of said first function cell and a second M3 metal formation connected to said M2 formation and a portion of said second functional cell.

A system, comprising:

• a design unit adapted to provide a design for an integrated circuit device, wherein said design comprises first functional cell and a first pair of wide metal formations comprising a first metal formation and a second metal placed about a first cell boundary of said functional cell for providing at least one of additional space for routing, high-drive routing, and power routing;
• a semiconductor device processing system for fabricating an integrated circuit device based upon said design;
• and
• a processing controller operatively coupled to said semiconductor device processing system, said processing controller configured to control an operation of said semiconductor device processing system.