US 2018/0004864 A1Published application

Hybrid modeling for a device under test associated with a two-phase cooling system

AssigneeInternational Business Machines Corporation

InventorsTimothy Joseph Chainer, Pritish Ranjan Parida

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Abstract

Techniques that facilitate hybrid modeling for a device under test associated with a cooling system (e.g., a two-phase cooling system) are provided. In one example, information indicative of a first model of a device under test associated with a cooling system is determined. Second information indicative of constraints that define values for an operational quantity related to the cooling system is also determined. Information indicative of a second model for the device under test is generated based on the information indicative of the first model and the second information indicative of the one or more constraints. In an aspect, a first simulation process is performed to determine first thermal properties for a first simulation domain associated with the device under test. In another aspect, a second simulation process is performed to determine second thermal properties for a second simulation domain associated with the device under test.

Claims20

Dependent claims

A system comprising:

a memory that stores computer executable components;
a processor that executes computer executable components stored in the memory, wherein the computer executable components comprise:
a device model component that determines first information indicative of a first model of a device under test that receives a coolant fluid;
a system component that determines second information indicative of one or more constraints that define a first value and a second value for an operational quantity related to a cooling system associated with the device under test;
and
a hybrid model component that generates third information indicative of a second model for the device under test based on the first information indicative of the first model and the second information indicative of the one or more constraints, wherein the hybrid model component performs a first simulation process to determine first thermal properties for a first simulation domain associated with the device under test, wherein the hybrid model component performs a second simulation process to determine second thermal properties for a second simulation domain associated with the device under test, wherein the second simulation process comprises a lower number of computational steps than steps associated with the first simulation process, and wherein the hybrid model component performs the first simulation process based on data generated by the second simulation process.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/196,713Filed 29 Jun 2016
Published: 4 Jan 2018
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

G06F 30/20
Computer-aided design [CAD]: design optimisation, verification or simulation
F24F 11/30
Control or safety arrangements: for purposes related to the operation of the system, e.g. for safety or monitoring
F24F 11/52
Characterised by user interfaces or communication: indication arrangements, e.g. displays
G06F 2113/18
Details relating to the application field: chip packaging