Piezoelectric package-integrated surface acoustic wave sensing devices

A package substrate comprising:

• a plurality of organic dielectric layers and a plurality of conductive layers to form the package substrate;
• and
• a piezoelectric sensing device integrated within the package substrate, the piezoelectric sensing device including a piezoelectric transmit transducer to receive input electrical signals and to generate, in response to the input electrical signals, a surface acoustic wave to be transmitted along a surface of the sensing device, a piezoelectric receive transducer to receive the surface acoustic wave and to generate output electrical signals in response to the surface acoustic wave, and an input region that is capable of receiving input which changes an acoustic amplitude of the surface acoustic wave.

A computing device comprising:

• at least one processor to process data;
• and
• a package substrate coupled to the at least one processor, the package substrate including a plurality of organic dielectric layers and a plurality of conductive layers to form the package substrate which includes a piezoelectric sensing device having a piezoelectric transmit transducer to receive input electrical signals and to generate, in response to the input electrical signals, a surface acoustic wave to be transmitted along a surface of the sensing device, a piezoelectric receive transducer to receive the surface acoustic wave and to generate output electrical signals in response to the surface acoustic wave, and an input region that is capable of receiving input which changes an acoustic amplitude of the surface acoustic wave.