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US 2018/0004032 A1Published application
Plastic substrate and device including the same
AssigneeKolon Industries, Inc.
InventorsHak Gee JUNG, Jeong Han KIM, Hyo Jun PARK
Life of this patent
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Abstract
Disclosed is a plastic substrate, which includes a plastic film, a metal layer, and a resin layer having a conductive material dispersed therein and which is useful as a lower substrate of a transmissive electronic paper display device or a display device.
Claims37
A plastic substrate, comprising:
- a plastic film;
- a metal layer formed on the plastic film, wherein the conductive metal layer has a thickness ranging from 1 to 1000 nm;
- a resin layer formed on the metal layer, wherein the resin layer has a thickness ranging from 10 nm to 25.5 μm,
- wherein the plastic film and resin layer are a polyimide having an average coefficient of linear thermal expansion of 50.0 ppm/° C. or less when measured in a temperature range from 50° C. to 250° C. using a thermomechanical analyzer for a film thickness of 50-100 μm, with a yellowness index of 15 or less, and
- wherein the plastic substrate has a light transmittance of 50% or more at a wavelength of 500 nm and a surface resistivity of 2.5×106Ω/sq or less.
2 more elements
Dependencies are inferred from the claim text.