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US 2018/0003894 A1Published application
Semiconductor device packages
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYi-Min CHIN, Yung-Shun Chang, Mei-Ju Lu, Jia-Hao Zhang, Wen-Chi Hung
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Abstract
A semiconductor device package includes a substrate and an optical device. The optical device includes a first portion extending into the substrate and not extending beyond a first surface of the substrate. The optical device further includes a second portion extending along the first surface of the substrate.
Claims23
A semiconductor device package, comprising:
- a substrate having a first surface;
- and
- an optical device comprising a first portion extending into the substrate and under the first surface of the substrate, and further comprising a second portion extending along the first surface of the substrate.
A semiconductor device package, comprising:
- a substrate having a first surface, the substrate defining a space having a bottom surface;
- a waveguide in the substrate;
- and
- an optical device disposed in the space and separated from the bottom surface of the space by a distance, the optical device comprising
- an alignment portion extending along the first surface of the substrate and supported by the first surface of the substrate;
- and
- a light emitting or a light receiving portion aligned with the waveguide.
4 more elements
A semiconductor device package, comprising:
- a substrate comprising a first surface;
- and
- an optical device comprising a first portion extending into the substrate without protruding from the first surface of the substrate, and a second portion extending along the first surface of the substrate;
- wherein the second portion of the optical device is directly disposed on the first surface of the substrate.
1 more element
Dependencies are inferred from the claim text.