In die stepping sort
AssigneeIntel Corporation
InventorsDae-Woo Kim, J. Daniel Bryan, Joseph W. Parks, JR., Ethan Caughey, Mark W. Dryfuse
Life of this patent
Estimating the term…
Abstract
An apparatus for testing a die can comprise a first printed circuit board (PCB), a space transformer, and a plurality of probes. The first PCB can be configured to connect to a second PCB. The space transformer can be attached to the PCB. The space transformer can include a plurality of traces. Each of the plurality of probes can be connected to one of the plurality of traces. The plurality of probes can be arranged in a pattern having a pitch less than 65 microns.
Claims22
An apparatus for testing a die, the apparatus comprising:
- a first printed circuit board (PCB) configured to connect to a second PCB, the second PCB being larger than the first PCB;
- a space transformer attached to the first PCB, the space transformer including a plurality of traces;
- and
- a plurality of probes, each of the plurality of probes connected to one of the plurality of traces, the plurality of probes arranged in a pattern having a pitch less than 65 microns.
An apparatus for testing a plurality of dies, each of the plurality of dies having a plurality of bumps, the apparatus comprising:
- a test head having a plurality of probes, each of the plurality of probes connected to one of a plurality of traces of a space transformer, the plurality of probes arranged in a pattern having a pitch less than 65 microns;
- a processor;
- and
- a memory storing instructions that, when executed by the processor, cause the processor to:
- actuate the test head such that the plurality of probes contact a subset of the plurality of bumps of one of the plurality of dies, and
- receive a voltage signal from the plurality of probes when the plurality of probes is in contact with the subset of the plurality of bumps of the one of the plurality of dies.
A method of testing a plurality of dies having a plurality of bumps, the method comprising:
- contacting a first subset of the plurality of bumps with a plurality of probes of a test head including the plurality of probes arranged in a pattern having a pitch less than 65 microns;
- transmitting, via the test head, a test signal through each of a plurality of traces within the die;
- and
- receiving, at a computing device from the test head, a return signal indicating a continuity state of a plurality of traces, each of the plurality of traces connecting a pair of bumps of the subset of bumps.
An apparatus for testing a plurality of dies, each of the plurality of dies having a plurality of bumps, the apparatus comprising:
- means for contacting a subset of the plurality of bumps of one of the plurality of dies, the contacting means including a plurality of probes arranged in a pattern having a pitch less than 65 microns;
- and
- means for receiving a test signal from the contacting means when the contacting means is in contact with the subset of the plurality of bumps.
Dependencies are inferred from the claim text.