Piezoelectric package-integrated temperature sensing devices

A computing device comprising:

• at least one processor to process data;
• and
• a package substrate coupled to the at least one processor, the package substrate including a plurality of organic dielectric layers and a plurality of conductive layers to form the package substrate which includes a piezoelectric temperature sensing device having a base structure that is positioned in proximity to a cavity of the package substrate, an input transducer coupled to the base structure, and an output transducer coupled to the base structure, wherein the input transducer has a first piezoelectric material to generate vibrations which are transmitted on the base structure in response to input signals being applied to the input transducer and the output transducer has a second piezoelectric material to receive the vibrations and to generate output signals which are used to determine a change in ambient temperature.