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US 2018/0003477 A1Published application
Method and system for measuring geometric parameters of through holes
AssigneeCorning Incorporated
InventorsUta-Barbara Goers, Robert Wendell Sharps
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Abstract
A method of measuring geometric parameters of through holes in a thin substrate includes acquiring images of select sub-volumes of the substrate using an optical system having a field of depth greater than a thickness of the substrate. The acquired images are processed to determine the desired geometric parameters.
Claims22
A method of measuring geometric parameters of through holes in a substrate, comprising:
- positioning a camera comprising an image sensor and a lens having a depth of field greater than a thickness of the substrate at a measuring station;
- positioning a select sub-volume of the substrate within a field of view of the camera and within the depth of field;
- illuminating the select sub-volume;
- capturing an image of the select sub-volume on the image sensor;
- and
- processing the image to determine at least one geometric parameter of at least one through hole in the select sub-volume.
3 more elements
A system for measuring geometric parameters of through holes in a substrate, comprising:
- a camera comprising an image sensor and a lens having a depth of field greater than a thickness of the substrate, the camera positioned at a select working distance relative to the substrate such that a select sub-volume of the substrate is within a field of view of the camera and within the depth of field;
- a lighting arrangement for illuminating the select sub-volume;
- and
- a processor configured to receive image data from the camera and determine from the image data at least one geometric parameter of at least one through hole in the select sub-volume.
1 more element
Dependencies are inferred from the claim text.