Thin film deposition system capable of physical vapor deposition and chemical vapor deposition simultaneously
AssigneeThe Regents of the University of California
InventorNobuhiko Kobayashi
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Abstract
A multi-deposition chamber apparatus is provided that includes a first deposition chamber that includes a substrate holder, a retractable sputter gun, a gate valve, an output port, a retractable chamber separator, a gas input port, a gas output port, and an electron cyclotron resonance plasma source, where the retractable chamber separator is configured to selectively segment the first deposition chamber to form a second deposition chamber, where the second deposition chamber comprises the substrate holder, the gas input port, the gas output port and the electron cyclotron resonance plasma source.
Claims10
1) A single deposition chamber apparatus comprising a first deposition mode and a second deposition mode, wherein said deposition modes are configured to alternate, wherein said single deposition chamber comprises:
- a) a substrate holder;
- b) a retractable sputter gun;
- c) a gate valve;
- d) an output port;
- e) a retractable chamber separator;
- f) a gas input port;
- g) a gas output port;
- and
- h) an electron cyclotron resonance plasma source;
- wherein said retractable chamber separator is configured to selectively segment said deposition chamber to alternate between said first deposition mode and said second deposition mode, wherein said second deposition comprises said substrate holder, said gas input port, said gas output port and said electron cyclotron resonance plasma source.
Dependencies are inferred from the claim text.