Anisotropic conductive film
AssigneeDexerials Corporation
InventorsDaisuke SATO, Yasushi AKUTSU, Ryousuke ODAKA, Yusuke TANAKA
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Abstract
An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.
Claims8
An anisotropic conductive film comprising an insulating adhesive layer and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view, wherein the conductive particle has a conductive particle diameter of 10 μm or more, the film has a thickness of 1 or more times and 3.5 or less times the conductive particle diameter, and positions of the conductive particles are varied in a thickness direction of the film within a variation range of less than 10% of the conductive particle diameter.
Dependencies are inferred from the claim text.