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US 2018/0002571 A1Published application
Additives for Barrier Chemical Mechanical Planarization
AssigneeVersum Materials US, LLC
InventorsMatthias Stender, Maitland Gary Graham, Dnyanesh Chandrakant Tamboli, Xiaobo Shi
Life of this patent
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Abstract
A barrier chemical mechanical planarization polishing composition is provided that includes suitable chemical additives. The suitable chemical additives are silicate compound and high molecular weight polymers/copolymers. There is also provided a chemical mechanical polishing method using the barrier chemical mechanical planarization polishing composition.
Claims35
A polishing composition comprising:
- water;
- an abrasive;
- a polymer selected from the group consisting of poly(acrylic acid), poly(meth-acrylic acid), poly(2-acrylamido-2-methyl-1-propanesulfonic acid, carboxymethyl cellulose, methyl cellulose, hydroxypropyl methyl cellulose, poly-(1-vinylpyrroliddone-co-2-dimethylaminoethyl methacrylate), poly(sodium 4-styrenesulfonate), poly(ethylene oxide), poly(4-sytrenesulfonic acid), polyacrylamide, poly(acrylamide/acrylic acid) copolymers, and combinations thereof, and salts thereof and wherein the polymer has a molecular weight of from 30,000 to 30,000,000 Daltons;
- a corrosion inhibitor;
- an inorganic silicate;
- an oxidizer;
- and, optionally,
- a surfactant;
- a pH-adjusting agent;
- a chelating agent,
- wherein the polishing composition has a pH of from about 7 to about 11.5, and wherein the viscosity of the polishing composition is from about 1.5 cP to about 10 cP.
8 more elements
Dependencies are inferred from the claim text.