Curable silicone formulations and related cured products, methods, articles, and devices

A method of making a concentrated silicone formulation from a butyl acetate-silicone formulation comprising (A) an organopolysiloxane containing an average, per molecule, of at least two silicon-bonded alkenyl groups;

• (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule;
• (C) a hydrosilylation catalyst;
• and a coating effective amount of (D) butyl acetate;
• with the proviso that the butyl acetate-silicone formulation lacks a thermally conductive filler, the method comprising coating and/or soft baking the butyl acetate-silicone formulation so as to remove from 90 percent to less than 100 percent of the coating effective amount of (D) butyl acetate therefrom without curing same so as to give a concentrated silicone formulation consisting essentially of (A) an organopolysiloxane containing an average, per molecule, of at least two alkenyl groups;
• (B) an organosilicon compound containing an average, per molecule, of at least two silicon-bonded hydrogen atoms;
• a catalytic amount of (C) a hydrosilylation catalyst;
• and a residual amount of (D) butyl acetate;
• with the proviso that the formulation lacks a thermally conductive filler.

A method of making a cured silicone product, the method comprising removing all of the (D) butyl acetate from a butyl acetate-silicone formulation or a concentrated silicone formulation without curing same to give a butyl acetate-free curable silicone formulation and hydrosilylation curing the butyl acetate-free curable silicone formulation to give the cured silicone product;

• with the proviso that the product lacks a thermally conductive filler;
• wherein prior to the removing step the butyl acetate silicone formulation comprised (A) an organopolysiloxane containing an average, per molecule, of at least two silicon-bonded alkenyl groups;
• (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule;
• (C) a hydrosilylation catalyst;
• and a coating effective amount of (D) butyl acetate;
• with the proviso that the butyl acetate-silicone formulation lacks a thermally conductive filler;
• and wherein prior to the removing step the concentrated silicone formulation consisted essentially of (A) an organopolysiloxane containing an average, per molecule, of at least two alkenyl groups;
• (B) an organosilicon compound containing an average, per molecule, of at least two silicon-bonded hydrogen atoms in a concentration sufficient to cure the formulation;
• a catalytic amount of (C) a hydrosilylation catalyst;
• and a residual amount of (D) butyl acetate;
• with the proviso that the concentrated silicone formulation lacks a thermally conductive filler.