Compositions Including a High Molecular Weight Acid Suitable for Conductive Polymer Formation on Dielectric Substrate
AssigneeMacDermid Enthone Inc.
InventorsChristian Rietmann, Andreas Glöckner
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AssigneeMacDermid Enthone Inc.
InventorsChristian Rietmann, Andreas Glöckner
Estimating the term…
The invention relates to a composition and a process for the deposition of conductive polymers on dielectric substrates. In particular, the invention relates to a composition for the formation of electrically conductive polymers on the surface of a dielectric substrate, the composition comprising at least one polymerizable monomer which is capable to form a conductive polymer, an emulsifier and an acid, characterized in that the composition comprises at least one metal-ion selected from the group consisting of lithium-ions, sodium-ions, aluminum-ions, beryllium-ions, bismuth-ions, boron-ions, indium-ions and alkyl imidazolium-ions. The acid is typically a high molecular weight polymeric acid having molecular weight of at least 500,000 Da including, for example, polystyrene sulfonic acid having a molecular weight of approximately 1,000,000 Da.
A composition for the formation of electrically conductive polymers on the surface of a dielectric substrate, the composition comprising:
A method for metalizing a surface of a dielectric substrate by deposition of a metal, the method comprising:
Dependencies are inferred from the claim text.